模塊化全自動清洗機特點：
模塊化組合結構，佔地小，方便運輸。
適合電子組裝件的清洗：如中大批量PCBA 及半導體后道序封裝。
創新的步進推進機構，使得生產效率成倍提高。
全工藝清洗系統：浸入式單元、噴淋單元和乾燥單元配套組合。
Key features
Modular combination structure, small footprint, convenient transportation.
Suitable for cleaning electronic assembly parts, such as PCBA and
semiconductor packaging.
The innovative step-by-step mechanism makes the production efficiency doubled.
Whole process cleaning system: Including Immersion unit, spray unit and drying unit.
