模块化全自动清洗机特点：
模块化组合结构，占地小，方便运输。
适合电子组装件的清洗：如中大批量PCBA 及半导体后道序封装。
创新的步进推进机构，使得生产效率成倍提高。
全工艺清洗系统：浸入式单元、喷淋单元和干燥单元配套组合。
Key features
Modular combination structure, small footprint, convenient transportation.
Suitable for cleaning electronic assembly parts, such as PCBA and
semiconductor packaging.
The innovative step-by-step mechanism makes the production efficiency doubled.
Whole process cleaning system: Including Immersion unit, spray unit and drying unit.
